This project builds the ZombieVerter VCU (Vehicle Control Unit) V1, an open-source automotive electronic control unit based on the OpenInverter architecture. The board supervises electric vehicle conversions by interfacing with OEM vehicle drivetrains, inverters, battery management systems (BMS), DC-DC converters, and chargers (supporting CAN, LIN, and synchronous serial protocols). The system operates from a nominal 12 V automotive battery rail (typically 9 V to 16 V DC, with load-dump tolerance up to 40 V), with an on-board buck step-down converter providing an intermediate 5.0 V power rail, and a linear regulator delivering the regulated 3.3 V logic rail used by the microcontroller, transceivers, and digital potentiometers.

Bill of Materials

Microcontroller and Power Management

• STM32F107VCT6 / GD32F107VCT6 (IC8)

  • Quantity: 1
  • Footprint/package: LQFP-100 (14.0 mm x 14.0 mm, 0.5 mm pin pitch)
  • Electrical constraints: 3.3 V logic supply (2.0 V to 3.6 V operating range); 72 MHz ARM Cortex-M3 Connectivity Line MCU with 256 KB Flash, dual CAN controllers, and advanced timers.
  • Substitution latitude: Must be pin-compatible and peripheral-compatible STM32F107VCT6 or GigaDevice GD32F107VCT6. The firmware relies directly on the hardware registers and pin multiplexing of the STM32F107 connectivity line (especially its dual internal bxCAN peripherals and timer mappings).
  • Operated control: No.
  • Sourcing plan: distributor lookup: STM32F107VCT6

• XL1509-5.0E1 (IC11)

  • Quantity: 1
  • Footprint/package: SOP-8 (SOIC-8, 3.9 mm x 4.9 mm, 1.27 mm pin pitch)
  • Electrical constraints: Input voltage up to 40 V DC (tolerating 12 V automotive system spikes); fixed 5.0 V DC output; 2 A internal switch current limit; 150 kHz buck switching regulator.
  • Substitution latitude: Must provide 5.0 V fixed output at ≥ 2 A from an input voltage ≥ 40 V with an identical SOP-8 pinout (Pin 1: VIN, Pin 2: Output, Pins 3/4: Feedback/ON/OFF, Pins 5–8: GND), or direct pin-compatible equivalents.
  • Operated control: No.
  • Sourcing plan: distributor lookup: XL1509-5.0E1

• AMS1117-3.3V (BOM: AMS117-3.3V) (IC4)

  • Quantity: 1
  • Footprint/package: SOT-223
  • Electrical constraints: 5.0 V input rail; 3.3 V fixed output; rated output current ≥ 800 mA / 1.0 A; low-dropout linear regulator.
  • Substitution latitude: Any standard positive 3.3 V fixed low-dropout linear regulator in SOT-223 with standard pinout (Pin 1: GND, Pin 2/Tab: VOUT, Pin 3: VIN) capable of delivering ≥ 800 mA.
  • Operated control: No.
  • Sourcing plan: distributor lookup: AMS1117-3.3

Vehicle Bus Transceivers and Communications

• MCP25625T-E/ML (BOM: MCP25625T-E_ML) (IC10)

  • Quantity: 1
  • Footprint/package: QFN-28_EP (6.0 mm x 6.0 mm, 0.65 mm pin pitch with exposed thermal pad)
  • Electrical constraints: Integrated Standalone CAN 2.0B Controller with high-speed CAN transceiver; 5.0 V transceiver supply (VDD), 3.3 V logic interface (VIO); communicates with MCU over SPI.
  • Substitution latitude: Exact part required. Integrates an MCP2515 CAN controller engine with a transceiver in a specialized QFN-28 pinout; firmware CAN bus 3 driver relies specifically on this device.
  • Operated control: No.
  • Sourcing plan: distributor lookup: MCP25625T-E/ML

• SN65HVD230QDR (IC9, IC13, IC15, IC16, IC17, IC18)

  • Quantity: 6
  • Footprint/package: SOIC-8 (3.9 mm x 4.9 mm, 1.27 mm pin pitch)
  • Electrical constraints: 3.3 V single-supply high-speed CAN transceiver; AEC-Q100 qualified; bus fault protection up to -16 V to +16 V; supports ISO 11898-2.
  • Substitution latitude: Must be a 3.3 V-compatible high-speed CAN transceiver in SOIC-8 (e.g. SN65HVD230, SN65HVD230Q, TCAN330). Standard 5 V CAN transceivers (such as MCP2551) cannot be substituted directly because the VDD rail and MCU I/O operate at 3.3 V.
  • Operated control: No.
  • Sourcing plan: distributor lookup: SN65HVD230QDR

• NCV7356D1G (IC19)

  • Quantity: 1
  • Footprint/package: SOIC-8 (3.9 mm x 4.9 mm, 1.27 mm pin pitch)
  • Electrical constraints: Single-Wire CAN (SW-CAN) transceiver compliant with SAE J2411; operates from 12 V automotive battery rail with 3.3 V/5.0 V logic compatibility.
  • Substitution latitude: Must be NCV7356D1G or equivalent pin-compatible SAE J2411 single-wire CAN transceiver in SOIC-8 (e.g. MC33897). Used for GM/Opel and specific OEM vehicle network interfaces.
  • Operated control: No.
  • Sourcing plan: distributor lookup: NCV7356D1G

• TJA1055T/3/C,518 (BOM: TJA1055T_3_C,518) (IC20)

  • Quantity: 1
  • Footprint/package: SOIC-14 (3.9 mm x 8.7 mm, 1.27 mm pin pitch)
  • Electrical constraints: Enhanced Fault-Tolerant Low-Speed CAN transceiver (ISO 11898-3); 3.3 V microcontroller interface (VIO pin compatible via the /3 variant); battery rail supply up to 27 V.
  • Substitution latitude: Must be TJA1055T/3/C (or /3 variant) specifically, as the /3 suffix denotes low logic level compatibility (3.3 V interface to the STM32). Standard TJA1055T without /3 requires 5 V I/O.
  • Operated control: No.
  • Sourcing plan: distributor lookup: TJA1055T/3/C,518

• TJA1020T/CM,118 (BOM: TJA1020T_CM,118) (IC14)

  • Quantity: 1
  • Footprint/package: SOIC-8 (3.9 mm x 4.9 mm, 1.27 mm pin pitch)
  • Electrical constraints: LIN 2.0 / SAE J2602 local interconnect network physical layer transceiver; operates from 12 V vehicle battery rail with 3.3 V logic interface to STM32 USART1.
  • Substitution latitude: Pin-compatible LIN transceivers in SOIC-8 (e.g. TJA1020, TJA1021, MCP2003) supporting baud rates up to 20 kBaud and 3.3 V logic levels.
  • Operated control: No.
  • Sourcing plan: distributor lookup: TJA1020T/CM,118

• MAX3221ECPWR (IC30)

  • Quantity: 1
  • Footprint/package: TSSOP-16 / HTSSOP-16 (4.4 mm x 5.0 mm, 0.65 mm pin pitch)
  • Electrical constraints: 3.0 V to 5.5 V single-channel RS-232 line driver/receiver with ±15 kV ESD protection and internal charge pump.
  • Substitution latitude: Any pin-compatible 3.3 V single-driver/single-receiver RS-232 transceiver in TSSOP-16 (e.g. MAX3221, ICL3221, SP3221E).
  • Operated control: No.
  • Sourcing plan: distributor lookup: MAX3221ECPWR

Drivers, Amplifiers, Memory, and Control ICs

• NCV8402 (IC1, IC3, IC5, IC6, IC7, IC24, IC25, IC26)

  • Quantity: 8
  • Footprint/package: SOT-223
  • Electrical constraints: Self-protected low-side Smart Discrete N-channel MOSFET; internal drain-to-gate clamping at 42 V; continuous current ≥ 2.0 A; RDS(on) ≤ 200 mΩ; logic-level gate drive directly driven by STM32 3.3 V outputs to switch 12 V vehicle contactors and relays.
  • Substitution latitude: Must be self-protected low-side power switches in SOT-223 with integrated over-temperature, over-current, and over-voltage clamp protection capable of turning on at 3.3 V VGS (e.g. NCV8402ASTT1G, NCV8402STT1G, VNP10N07FI, BSP75N).
  • Operated control: No.
  • Sourcing plan: distributor lookup: NCV8402ASTT1G

• NCV8461DR2G (IC12)

  • Quantity: 1
  • Footprint/package: SOIC-8 (3.9 mm x 4.9 mm, 1.27 mm pin pitch)
  • Electrical constraints: Self-protected high-side power switch with internal charge pump; operates from 12 V automotive battery rail; drives positive 12 V outputs.
  • Substitution latitude: NCV8461 or pin-compatible automotive high-side driver in SOIC-8 with internal clamping, thermal shutdown, and current limiting.
  • Operated control: No.
  • Sourcing plan: distributor lookup: NCV8461DR2G

• FAN3122TMX (IC27, IC28, IC29)

  • Quantity: 3
  • Footprint/package: SOIC-8 (3.9 mm x 4.9 mm, 1.27 mm pin pitch)
  • Electrical constraints: Single 9 A high-speed low-side gate driver; non-inverting CMOS inputs compatible with 3.3 V logic; supply rail up to 18 V. Used for high-current PWM low-side drive.
  • Substitution latitude: Pin-compatible high-current (≥ 9 A) low-side gate drivers in SOIC-8 with non-inverting input logic (e.g. FAN3122, MCP1407, UCC27511).
  • Operated control: No.
  • Sourcing plan: distributor lookup: FAN3122TMX

• AD5160BRJZ10-RL7 (IC21, IC22)

  • Quantity: 2
  • Footprint/package: SOT-23-8
  • Electrical constraints: 256-position SPI-compatible digital potentiometer; 10 kΩ end-to-end resistance; operates on 3.3 V rail. Used to synthesize analog throttle/accelerator pedal signals to OEM inverters.
  • Substitution latitude: Must be the 10 kΩ variant in SOT-23-8 (AD5160BRJZ10). Suffix indicates 10 kΩ resistance; substituting 5 kΩ, 50 kΩ, or 100 kΩ models will invalidate pedal calibration.
  • Operated control: No (digitally controlled by MCU firmware).
  • Sourcing plan: distributor lookup: AD5160BRJZ10-RL7

• M24M02 / M2401 (IC2)

  • Quantity: 1
  • Footprint/package: SOIC-8 (3.9 mm x 4.9 mm, 1.27 mm pin pitch)
  • Electrical constraints: 2-Mbit (M24M02) or 1-Mbit (M24M01) I2C serial EEPROM; 3.3 V supply; used for storing vehicle configuration parameters and calibrations.
  • Substitution latitude: M24M02-DRMN6TP (2 Mbit) or M24M01-RMN6TP (1 Mbit) I2C EEPROM in SOIC-8. Note: The BOM designates "M24M02/M2401"; the firmware memory allocation requires ≥ 1 Mbit capacity.
  • Operated control: No.
  • Sourcing plan: distributor lookup (representative example — sources give spec only): M24M02-DRMN6TP

• TDA2822D013TR (IC23)

  • Quantity: 1
  • Footprint/package: SOP-8 / SOIC-8 (3.9 mm x 4.9 mm, 1.27 mm pin pitch)
  • Electrical constraints: Dual low-voltage audio power amplifier; operates from 1.8 V to 15 V; drives audio tones / sound transducers or low-impedance analog outputs.
  • Substitution latitude: TDA2822D, TDA2822M (surface mount variant), or pin-compatible dual audio amplifier in SOIC-8.
  • Operated control: No.
  • Sourcing plan: distributor lookup: TDA2822D013TR

Discrete Semiconductors

• MMBT3904 (TR1, TR2)

  • Quantity: 2
  • Footprint/package: SOT-23-3
  • Electrical constraints: General-purpose NPN bipolar junction transistor; VCEO ≥ 40 V, IC ≥ 200 mA, hFE ≥ 100; switching small-signal levels.
  • Substitution latitude: Any commodity NPN small-signal transistor in SOT-23 (e.g. MMBT3904, 2N3904, BC847).
  • Operated control: No.
  • Sourcing plan: distributor lookup: MMBT3904

• SS54 (D1, D5)

  • Quantity: 2
  • Footprint/package: SMA (DO-214AC)
  • Electrical constraints: Surface-mount Schottky barrier rectifier; continuous forward current IF = 5.0 A; peak repetitive reverse voltage VRRM = 40 V; used as reverse-polarity protection and freewheeling catch diode for the XL1509 buck converter.
  • Substitution latitude: Any 5.0 A, ≥ 40 V Schottky diode with low forward voltage drop in SMA or SMB footprint (e.g. SS54, SK54, B540A).
  • Operated control: No.
  • Sourcing plan: distributor lookup: SS54

• 1N4148WS (D2, D3, D4, D6, D7, D8, D9, D10, D11)

  • Quantity: 9
  • Footprint/package: SOD-323F
  • Electrical constraints: Fast switching diode; VRRM ≥ 75 V / 100 V; IF ≥ 150 mA; trr ≤ 4 ns; used for signal steering and input clamping.
  • Substitution latitude: Any standard 1N4148WS fast switching diode in SOD-323 or SOD-323F package.
  • Operated control: No.
  • Sourcing plan: distributor lookup: 1N4148WS

• Red LED (LED1, LED2)

  • Quantity: 2
  • Footprint/package: 0805 SMD
  • Electrical constraints: Forward voltage VF ~ 1.8 V to 2.2 V; IF nominal = 10 mA to 20 mA; visual board status/heartbeat indicators.
  • Substitution latitude: Any standard red indicator LED in 0805 SMD package.
  • Operated control: No.
  • Sourcing plan: distributor lookup (representative example — sources give spec only): APT2012EC

Passive Components: Inductors, Beads, Crystals, and Fuse

• DLP11SA900HL2L (L4, L5)

  • Quantity: 2
  • Footprint/package: SMD-4 (0403 inch / 1005 metric, 1.0 mm x 1.3 mm x 0.55 mm pitch)
  • Electrical constraints: Common-mode choke; common-mode impedance 90 Ω at 100 MHz; rated current 330 mA; DC resistance ≤ 0.8 Ω; used on high-speed differential CAN / serial lines.
  • Substitution latitude: Murata DLP11SA900HL2L or equivalent ultra-compact common mode choke in 0403/1005 metric with ~90 Ω impedance at 100 MHz.
  • Operated control: No.
  • Sourcing plan: distributor lookup: DLP11SA900HL2L

• MH2029-300Y (L1, L2)

  • Quantity: 2
  • Footprint/package: 0805 SMD
  • Electrical constraints: Surface-mount ferrite chip bead; impedance 30 Ω at 100 MHz; rated DC current ≥ 500 mA.
  • Substitution latitude: Any 0805 ferrite bead with impedance 30 Ω to 60 Ω at 100 MHz and current rating ≥ 500 mA.
  • Operated control: No.
  • Sourcing plan: distributor lookup: MH2029-300Y

• 68 µH Power Inductor (L3)

  • Quantity: 1
  • Footprint/package: SMD-PIND (12.5 mm x 12.5 mm x 8.0 mm max height, 2.9 mm x 5.4 mm pad footprint)
  • Electrical constraints: Inductance 68 µH ±20%; saturation current ISAT ≥ 2.0 A; RMS current IRMS ≥ 2.0 A; DC resistance ≤ 150 mΩ. Main buck inductor for XL1509-5.0.
  • Substitution latitude: Any shielded or unshielded power inductor in ~12.5 mm x 12.5 mm SMD footprint with inductance 68 µH and rated current ≥ 2.0 A.
  • Operated control: No.
  • Sourcing plan: distributor lookup (representative example — sources give spec only): MSS1278-683MLD

• 47 µH Inductor (L6)

  • Quantity: 1
  • Footprint/package: 0805 SMD
  • Electrical constraints: Inductance 47 µH; rated current ≥ 50 mA; filtering/choke application.
  • Substitution latitude: Any 0805 multilayer or wirewound SMD inductor of 47 µH.
  • Operated control: No.
  • Sourcing plan: distributor lookup (representative example — sources give spec only): MLZ2012N470LT000

• 8 MHz Crystal Resonator (X1)

  • Quantity: 1
  • Footprint/package: SMD-5032_2P (5.0 mm x 3.2 mm, 2-pad SMD)
  • Electrical constraints: Fundamental frequency 8.000 MHz; load capacitance ~18 pF to 20 pF; frequency tolerance ±30 ppm. Main system oscillator for STM32F107 HSE clock.
  • Substitution latitude: Any 8.000 MHz fundamental-mode crystal in 5.0 mm x 3.2 mm 2-pin package matching ~18 pF load capacitance.
  • Operated control: No.
  • Sourcing plan: distributor lookup (representative example — sources give spec only): ABLS-8.000MHZ-B4-T

• 16 MHz Crystal Resonator (X2)

  • Quantity: 1
  • Footprint/package: SMD-CRY-3225_4P (3.2 mm x 2.5 mm, 4-pad SMD)
  • Electrical constraints: Fundamental frequency 16.000 MHz; load capacitance ~10 pF to 18 pF. Clock source for MCP25625 CAN controller.
  • Substitution latitude: Any 16.000 MHz crystal in 3.2 mm x 2.5 mm 4-pad package.
  • Operated control: No.
  • Sourcing plan: distributor lookup (representative example — sources give spec only): FA-238 16.0000MB-C3

• Fuse 500 mA Slow Blow (F1)

  • Quantity: 1
  • Footprint/package: 2410 SMD (6.1 mm x 2.5 mm, EIA 2410 / metric 6125)
  • Electrical constraints: Current rating 500 mA (0.5 A); time-lag / slow-blow characteristic; automotive rated DC voltage ≥ 32 V DC (preferably ≥ 63 V DC).
  • Substitution latitude: Any 2410/6125 SMD slow-blow fuse rated 500 mA and ≥ 32 V DC (e.g. Littelfuse 0466 series or 0468 series).
  • Operated control: No.
  • Sourcing plan: distributor lookup (representative example — sources give spec only): 0466.500NR

Passive Components: Capacitors

• 0805 SMD Ceramic Capacitors

  • Quantity: 66 total
  • Footprint/package: 0805 SMD
  • Electrical constraints: Voltage rating ≥ 50 V for components on 12 V rail; ≥ 16 V or ≥ 25 V for components on 5 V / 3.3 V rails; dielectric X7R or X5R (C0G/NP0 for values ≤ 1 nF); ±10% or ±5% tolerance.
  • Values and designators:
    • 22 pF (C10, C11) — 2 pcs (C0G, crystal load)
    • 100 pF (C64, C65) — 2 pcs (C0G)
    • 3.3 nF / 3n3 (C45) — 1 pc
    • 10 nF (C68) — 1 pc
    • 0.1 µF (C4, C9, C12, C16, C18, C19, C24, C26, C27, C28, C32, C34, C36, C37, C40, C41, C42, C43, C50, C51, C53, C55, C56, C62, C73, C74) — 26 pcs (Decoupling)
    • 0.47 µF (C57, C58, C59) — 3 pcs
    • 1.0 µF (C2, C3, C5, C6, C7, C8, C14, C15, C22, C30, C31, C33, C38, C39, C44, C46, C47, C48, C54, C60, C61, C63, C66, C67, C70, C71, C72) — 27 pcs (Decoupling)
    • 10 µF (C1, C25, C35, C49, C52) — 5 pcs (X7R/X5R, rated ≥ 16 V)
  • Substitution latitude: Standard commodity SMD MLCCs matching or exceeding voltage ratings and dielectric stability.
  • Operated control: No.
  • Sourcing plan: distributor lookup (representative example — sources give spec only): generic 0805 MLCC capacitors

• 1206 SMD Ceramic Capacitors: 100 µF (C17, C21)

  • Quantity: 2
  • Footprint/package: 1206 SMD
  • Electrical constraints: Capacitance 100 µF; voltage rating ≥ 6.3 V (preferably ≥ 10 V); dielectric X5R or X7R.
  • Substitution latitude: Any 100 µF, ≥ 10 V X5R/X7R ceramic capacitor in 1206 footprint.
  • Operated control: No.
  • Sourcing plan: distributor lookup (representative example — sources give spec only): CL31A107MQHNNNE

• Tantalum / Molded Capacitors: 100 µF 6.3 V (C13, C20, C23)

  • Quantity: 3
  • Footprint/package: CASE-B_3528 (EIA 3528-21, 3.5 mm x 2.8 mm)
  • Electrical constraints: Capacitance 100 µF; rated voltage 6.3 V DC; polarized tantalum or molded aluminum polymer.
  • Substitution latitude: Any 100 µF, ≥ 6.3 V polarized capacitor in standard EIA 3528 (Case B) footprint with low ESR.
  • Operated control: No.
  • Sourcing plan: distributor lookup (representative example — sources give spec only): T491B107M006AT

• SMD Aluminum Electrolytic Capacitors: 470 µF 25 V (C29, C69)

  • Quantity: 2
  • Footprint/package: SMD-ECAP-10x10 (Cylindrical SMD, 10.0 mm diameter x 10.0 mm height)
  • Electrical constraints: Capacitance 470 µF; voltage rating ≥ 25 V DC (handles 12 V vehicle battery spikes and buck input filtering); low ESR.
  • Substitution latitude: Any 470 µF, ≥ 25 V (or 35 V) SMD electrolytic capacitor with 10 mm x 10 mm can footprint.
  • Operated control: No.
  • Sourcing plan: distributor lookup (representative example — sources give spec only): EEE-FK1E471P

Passive Components: Resistors

• 0805 SMD Thick Film Resistors (1% tolerance, 0.125 W)
  • Quantity: 68 total (Designators R1–R18, R20–R69; note R19 is omitted in the sequence)
  • Footprint/package: 0805 SMD
  • Electrical constraints: 1% tolerance; power rating ≥ 0.1 W (1/10 W or 1/8 W); working voltage ≥ 50 V.
  • Values and designators:
    • 4.7 Ω (R67, R68) — 2 pcs
    • 120 Ω (R20, R24, R31, R32, R36, R40, R44) — 7 pcs (CAN bus termination and damping)
    • 680 Ω (R16, R22) — 2 pcs
    • 1.0 kΩ (R7, R8, R9, R10, R12, R13, R14, R17, R23, R25, R26, R30, R34, R37, R38, R39, R41, R42, R49, R55, R56, R57, R59, R60, R61, R65, R66) — 27 pcs
    • 1.5 kΩ (R2, R6, R11, R27, R29, R51, R53) — 7 pcs
    • 1.8 kΩ (R35, R43, R69) — 3 pcs
    • 2.7 kΩ (R45, R46, R58, R62) — 4 pcs
    • 3.0 kΩ (R48) — 1 pc
    • 4.7 kΩ (R1, R3, R4, R5, R15, R28, R33, R52, R54) — 9 pcs
    • 8.2 kΩ (R21) — 1 pc
    • 10 kΩ (R18, R47, R63, R64) — 4 pcs
    • 18 kΩ (R50) — 1 pc
  • Substitution latitude: Standard commodity 0805 thick-film resistors, 1% tolerance, ≥ 0.1 W.
  • Operated control: No.
  • Sourcing plan: distributor lookup (representative example — sources give spec only): generic 0805 thick-film resistors

Enclosure, Connectors, and Support Hardware

• Automotive Sealed Enclosure with Integrated 56-Way PCB Header

  • Quantity: 1
  • Footprint/package: Right-angle 56-pin automotive through-hole header footprint matching the enclosure faceplate (Delphi / Tyco AMP style 56-pin automotive ECU housing).
  • Electrical constraints: Rated for automotive under-hood / cabin environments; 56 contact positions rated ≥ 5 A per power pin, ≥ 2 A per signal pin.
  • Substitution latitude: Must match the PCB outline and 56-pin header pitch of the ZombieVerter V1 board layout. Sourced from automotive ECU enclosure vendors.
  • Operated control: No.
  • Sourcing plan: retail shopping search: AliExpress item 32857771975 56 pin automotive ecu enclosure

• 56-Way Wiring Harness Pigtail Cable

  • Quantity: 1
  • Footprint/package: Mating 56-pin automotive plug with pre-crimped wire pigtails.
  • Electrical constraints: Automotive grade copper wire, color-coded, mating latch mechanism.
  • Substitution latitude: Must mate with the 56-way header of the enclosure.
  • Operated control: No.
  • Sourcing plan: retail shopping search: AliExpress item 4001213569338 56 pin ecu wiring harness

• ESP8266 Wi-Fi Module (Optional Adapter)

  • Quantity: 1 (optional add-on)
  • Footprint/package: Header pins for external Wi-Fi module (as shown in schematic section "ESP WIFI MODULE").
  • Electrical constraints: 3.3 V logic and supply; serial UART interface (TX/RX) to STM32.
  • Substitution latitude: Standard ESP-01, ESP-12, or custom OpenInverter ESP8266 Wi-Fi adapter board loaded with OpenInverter web interface firmware.
  • Operated control: No.
  • Sourcing plan: retail shopping search: ESP8266 ESP-01 serial Wi-Fi module

Software and network dependencies

• GNU Arm Embedded Toolchain (arm-none-eabi-gcc)

  • Repository / Source: Ubuntu / Debian packages (sudo apt install gcc-arm-none-eabi) or Arm developer website (https://developer.arm.com/open-source/gnu-toolchain/gnu-rm/downloads).
  • Version: not stated.
  • Where the version came from: not stated.
  • Pinning: Unpinned. README.md (line 62) instructs users to run bare sudo apt install gcc-arm-none-eabi.
  • Manifest location: README.md
  • Check plan: support-status lookup: Ubuntu gcc-arm-none-eabi

• libopencm3

  • Repository / Source: https://github.com/jsphuebner/libopencm3
  • Version: not stated.
  • Where the version came from: not stated.
  • Pinning: Defined as a Git submodule in gitmodules.txt without an explicit branch, tag, or pinned commit hash specified in plain text files. Fetched via make get-deps.
  • Manifest location: gitmodules.txt lines 1–3
  • Check plan: not checkable: version not stated and no security advisory database tracks embedded hardware support libraries

• libopeninv

  • Repository / Source: https://github.com/jsphuebner/libopeninv.git
  • Version: not stated.
  • Where the version came from: not stated.
  • Pinning: Defined as a Git submodule in gitmodules.txt without a pinned commit hash or release tag. Fetched via make get-deps.
  • Manifest location: gitmodules.txt lines 4–6
  • Check plan: not checkable: version not stated and no security advisory database tracks embedded OpenInverter libraries

• ZombieVerter VCU Application Firmware (stm32-vcu)

  • Repository / Source: OpenInverter / Damien Maguire stm32-vcu repository on GitHub.
  • Version: not stated (README references firmware progression versions "V2.00a", "V2.05A", "V2.15a", "V2.20A", "V2.40A", but the firmware base release version is unpinned).
  • Where the version came from: not stated.
  • Pinning: Unpinned.
  • Manifest location: Makefile / README.md
  • Check plan: not checkable: custom open-source vehicle control firmware with no centralized advisory database

• updater.py (Firmware Flashing Script)

  • Repository / Source: Included within OpenInverter toolsets.
  • Version: not stated.
  • Where the version came from: not stated.
  • Pinning: Unpinned.
  • Manifest location: README.md line 78
  • Check plan: not checkable: standalone Python script with no package manifest

• Code::Blocks IDE

  • Repository / Source: https://www.codeblocks.org/
  • Version: not stated ("I use CodeBlocks IDE : https://www.codeblocks.org/" in README.md line 80).
  • Where the version came from: not stated.
  • Pinning: Unpinned.
  • Manifest location: README.md line 80
  • Check plan: not checkable: version not stated

• Network exposure:

  • Wi-Fi: The board provides an interface for an optional ESP8266 Wi-Fi adapter ("esp8266 web interface" cited in README.md line 78 and schematic block "ESP WIFI MODULE"). When fitted, the module serves an HTTP web interface allowing users to tune motor/inverter parameters and flash updated firmware over the air. The sources do not state the SSID, default credentials, or listening port numbers.
  • In-Vehicle Networks: Operates across multiple controller area network buses: standard CAN (ISO 11898-2), Single-Wire CAN (SAE J2411), Fault-Tolerant Low-Speed CAN (ISO 11898-3), and LIN (USART1). These networks transmit automotive telemetry and control commands; no network authentication or encryption is stated in the sources.
  • Instructions to enable SSH or open web interfaces: Documentation notes uploading firmware via "the esp8266 web interface". No SSH services or default credentials are documented in the sources.

Remaining Temporal Dependencies

• Online Repositories and Video Documentation:

  • Development forum thread: https://openinverter.org/forum/viewtopic.php?f=3&t=1277
  • External fast-charging Clara library dependency: https://github.com/uhi22/ccs32clara
  • Vimeo project and dyno test logs: https://vimeo.com/506480876, https://vimeo.com/802405172, https://vimeo.com/824494783, https://vimeo.com/1201141543
  • YouTube vehicle test video logs: https://www.youtube.com/watch?v=iwB3wxCEFo0, https://www.youtube.com/watch?v=wjlucUWX_lc
  • Patreon subscription reference: Full KiCad 9 source files require an active 10 Euro tier Patreon membership; GitHub repository hosts only compiled PDFs and Gerber archives.

• Procurement Links:

  • Enclosure/Header procurement link: https://www.aliexpress.com/item/32857771975.html (AliExpress item 32857771975)
  • Wiring harness procurement link: https://www.aliexpress.com/item/4001213569338.html (AliExpress item 4001213569338)

• Fabrication Specifications:

  • PCB Layer Count: Design requires a multi-layer board (typically 4 layers to route high-density LQFP-100 MCU signals and multiple isolated CAN/LIN ground/power planes).
  • Board Dimensions: Contoured PCB profile custom-dimensioned to slide into the internal guide rails of the 56-way waterproof automotive ECU enclosure specified in the BOM.
  • Connector Interface: Right-angle 56-pin through-hole footprint positioned at the front board edge to mate with the housing seal.